Thermalright AXP90-X53 Black Low-Profile Top-Flow CPU Cooler — Intel LGA1851/1700 / AMD AM5/AM4 | 150W TDP

The Thermalright AXP90-X53 Black is built for Mini-ITX builders, SFF system assemblers, and compact desktop users who need effective, quiet CPU cooling within strict height constraints — particularly in sandwich-style ITX cases, HTPC enclosures, and ultra-compact chassis where standard tower coolers cannot physically fit. It is well-suited for mid-range Intel and AMD desktop CPUs up to 150W TDP, including Intel Core 12th through 15th Gen and AMD Ryzen AM4/AM5 builds, where all-black aesthetics and low-profile performance are equally prioritised.

The AXP90-X53 Black features Thermalright's AGHP (Anti-Gravity Heat Pipe) technology across four 6mm copper heat pipes, solving the inverse gravity effect caused by vertical or horizontal orientation to ensure consistent heat transfer efficiency regardless of mounting direction — a critical advantage in SFF builds where cooler orientation may vary. The secondary reflow welding process between heat pipes and aluminium fins significantly improves thermal contact and heat dissipation efficiency over standard manufacturing methods. The C1100 pure copper nickel-plated base delivers superior thermal conductivity from the CPU IHS into the heat pipes, with the nickel plating preventing long-term oxidation and maintaining surface flatness. Black anodized aluminium fins with 0.3mm fin thickness and 1.6mm fin gap balance surface area with adequate airflow passage for the slim 92mm fan. The included all-black TL-9015B 92mm × 15mm slim PWM fan runs up to 2700 RPM with a hydraulic bearing for quiet and reliable operation, delivering 42.58 CFM max airflow and 1.33 mm-H2O static pressure at just 22.4 dBA — the slim 15mm profile is key to keeping total cooler height to exactly 53mm for ITX chassis compatibility. The entire 53mm total height — 38mm heatsink and 15mm fan — fits within the clearance limits of many popular Mini-ITX cases without obstruction to RAM, VRM heatsinks, or surrounding components.

Model: AXP90-X53 Black
Heatsink Dimensions: 94.5 mm (L) × 95 mm (W) × 38 mm (H)
Total Height (with Fan): 53 mm
Weight (with Fan): 330g
Heat Pipes: 4× 6mm Copper Heat Pipes (AGHP Technology)
Fin Material: Black Anodized Aluminium
Fin Thickness: 0.3mm
Fin Gap: 1.6mm
Base Material: C1100 Pure Copper (Nickel Plated)
Maximum TDP: 150W
Fan Model: TL-9015B (All Black)
Fan Dimensions: 92 × 92 × 15mm
Fan Bearing: Hydraulic Bearing
Fan Speed: 2700 RPM ±10% (Max)
Fan Airflow: 42.58 CFM (Max)
Fan Static Pressure: 1.33 mm-H2O (Max)
Fan Noise: 22.4 dBA
Fan Rated Current: 0.18A
Fan Connector: 4-Pin PWM
Colour: All Black

CPU Socket Compatibility:
Intel: LGA1851, LGA1700, LGA1200, LGA115X (1150/1151/1155/1156)
AMD: AM4, AM5

System Requirements: Compatible with Intel LGA1851, LGA1700, LGA1200, LGA115X and AMD AM4/AM5 platforms; verify case CPU cooler height clearance supports minimum 53mm total height before purchase; standard 4-pin PWM fan header required for speed management; included metal fasteners for both Intel and AMD platforms

Setup: Standard low-profile cooler installation via included Intel and AMD mounting hardware; thermal paste application recommended (not included — purchase separately or use CPU bundled paste); 4-pin PWM fan connects to motherboard CPU fan header for automatic temperature-based speed control

Mounting Options: Top-flow downward-blowing installation directly above CPU socket; 92mm fan sits flush within the heatsink footprint for compatibility with surrounding motherboard components; suitable for Mini-ITX, Micro-ATX, and ATX builds within 53mm height constraints

Usage Environment: Ideal for Mini-ITX builds, SFF and HTPC enclosures, sandwich-style cases, compact desktops, and any system requiring a reliable, quiet, and capable low-profile top-flow CPU cooler within 53mm total height