AMD Ryzen 9 9950X3D2 Dual Edition Desktop Processor — World's First Dual 3D V-Cache | 16 Cores | Up to 5.60 GHz | AM5

The AMD Ryzen 9 9950X3D2 Dual Edition is built for software developers, computational scientists, 3D artists, video editors, data scientists, AI researchers, and professional workstation builders who demand the absolute maximum in desktop multi-threaded throughput, L3 cache capacity, and AI-accelerated computing at the consumer platform level. It is well-suited for large software compilation, parallel code builds, multi-threaded 3D rendering, physics and engineering simulations, EDA workloads, machine learning inference, large dataset analysis, 4K and 8K video editing and encoding, and any professional desktop workload where both extreme performance and massive on-die cache capacity translate directly to faster results.

The Ryzen 9 9950X3D2 Dual Edition makes history as the world's first desktop processor to feature AMD 3D V-Cache on both compute dies simultaneously — stacking additional SRAM cache memory directly on top of two Zen 5 compute chiplets to deliver a massive 192MB of L3 cache total (128MB of 3D V-Cache + 32MB native L3 per CCD). This unprecedented cache capacity dramatically reduces cache misses and memory latency for large working datasets in professional and developer workloads, enabling near-instantaneous data access for cache-sensitive software compilation, simulation, and rendering tasks at a scale not previously possible in any desktop CPU. All 16 Zen 5 cores benefit from the full 3D V-Cache pool, with AMD's intelligent cache allocation dynamically directing workloads to the optimal die and cache tier in real time. The processor boosts up to 5.60GHz via Precision Boost 2 for strong single-thread performance alongside its exceptional multi-thread throughput. Built on TSMC 4nm FinFET process nodes for the CPU and TSMC 6nm for the I/O die across a 3-die package, it delivers significant IPC gains over prior Zen 4 X3D processors. Full unlocked overclocking via Precision Boost Overdrive, Curve Optimizer voltage offsets per-core, and AMD Ryzen Master software enable complete performance customization. AMD EXPO DDR5 memory overclocking support, ECC memory support, PCIe 5.0 with 28 total lanes, native USB 3.2 Gen 2, and NVMe RAID support round out the platform with next-generation connectivity.

Product ID (Box): 100-100001978WOF
Product ID (Tray): 100-000001978
CPU Family / Series: Ryzen 9 / Ryzen 9000 Series
Architecture: Zen 5 (Granite Ridge AM5)
CPU Core Technology: TSMC 4nm FinFET
I/O Die Technology: TSMC 6nm FinFET
Package Die Count: 3
Total Cores / Threads: 16 cores / 32 threads (SMT)
Base Clock: 4.30 GHz
Max Boost Clock: Up to 5.60 GHz
L1 Cache: 1280 KB
L2 Cache: 16 MB
L3 Cache: 192 MB (Dual 3D V-Cache)
3D V-Cache: Yes (Dual — on both compute dies)
Default TDP: 200W
Max Operating Temperature (Tjmax): 95°C
Socket: AM5
Supporting Chipsets: X870E, X870, B850, X670E, X670, B650E, B650, B840, A620
Memory Type: DDR5 (UDIMM)
Memory Channels: 2
Max Memory: 256GB
Memory Speed: DDR5-5600 (2×1R / 2×2R) | DDR5-3600 (4×1R / 4×2R)
ECC Support: Yes (requires motherboard support)
PCIe Version: PCIe 5.0
PCIe Lanes: 28 total / 24 usable
Native USB 3.2 Gen 2 (10Gbps): 4
Native USB 2.0 (480Mbps): 1
NVMe Support: Boot, RAID 0 / 1 / 5 / 10
Integrated Graphics: AMD Radeon Graphics (2 cores @ 2.2 GHz)
Unlocked for Overclocking: Yes
Technologies: Precision Boost 2, Precision Boost Overdrive, Curve Optimizer, AMD EXPO, AMD Ryzen Master, AMD Secure Processor, AES-NI, AVX512, AVX2, Virtualization (AMD-V, AMD-Vi, AVIC, SLAT), Firmware TPM, AMD Platform Secure Boot, Windows Secured-Core PC
OS Support: Windows 11 64-bit, Windows 10 64-bit, RHEL x86 64-bit, Ubuntu x86 64-bit
Thermal Solution: Not included (liquid cooler strongly recommended)

System Requirements: Compatible with AM5 motherboards on X870E, X870, B850, X670E, X670, B650E, B650, B840, and A620 chipsets; DDR5 memory required (DDR4 not supported); BIOS update may be required on older AM5 boards; 200W TDP demands a high-end VRM motherboard and robust power delivery — X870E or X670E strongly recommended for sustained workload performance

Setup: No bundled cooler — a high-end 360mm or 420mm AIO liquid cooler or premium custom loop is strongly recommended for sustained 200W TDP operation; ECC memory requires both CPU and motherboard ECC support; full overclocking features including PBO, Curve Optimizer, and EXPO require AMD Ryzen Master software

Mounting Options: Standard AM5 socket installation; compatible with AM5 cooler mounts (AM4 coolers require an adapter bracket)

Usage Environment: Ideal for elite developer workstations, 3D rendering and simulation builds, professional content creation, AI research and inference, large software compilation environments, and enthusiast desktop builds demanding the world's highest desktop cache capacity and multi-threaded Zen 5 performance